Product 01
Automation Solutions
Automated systems that streamline semiconductor and electronics production lines for higher throughput and consistency.
Product 02
Product Handling Solutions
Handling and transport solutions production environments.
Printed Circuit BoardPCB handling
PanelPanel handling
WafersWafer handling
Substrates / LeadframeSubstrate & leadframe handling
OHTOverhead hoist transport
AGVAutomated guided vehicle
AMRAutonomous mobile robot
MaintenanceHandling maintenance
Product 03
Cleaning Solutions
Aqueous and dry cleaning methods for semiconductor and electronics parts.
AqueousSpray-in-air, ultrasonic, megasonic and agitation cleaning.
DryCO₂ and atmospheric plasma cleaning.
Product 04
Thermal Process
Thermal processing and performance measurement for consistent results.
OvenConvection, IR and UV.
Performance measurementTemperature, vibration and air flow.
Product 05
Precision Bonding Solutions
Precision joining methods for electronics and semiconductor assembly.
Resistance WeldingResistance welding bonding.
UltrasonicUltrasonic bonding.
Hotbar Reflow / ACFHotbar reflow and ACF bonding.
LaserLaser bonding.
Product 06
Laser Process Solutions
Laser processing for precision electronics and semiconductor applications.
AblationMaterial ablation.
CuttingLaser cutting.
MarkingLaser marking.
WeldingLaser welding.
DeflashLaser deflashing.